SiC Process Engineering - Wafer Laser Splitting & Grinding M/F
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In this role you will contribute to the SiC technology ramp-up at ST in a new mass-production fab in Catania, driving efficient finishing processes for SiC substrates. You will collaborate with the Sweden center and internal teams to define flows, recipes, and qualification plans, ensuring robustness as operations scale. The position combines hands‑on process work with troubleshooting, tool qualification, and cross‑functional collaboration to deliver high‑quality, manufacturable processes. This is an opportunity to shape the production ramp and enable mass production of next‑generation SiC technology.
DEI initiatives
equal opportunities
employee resource groups
Hands‑on work with Laser Splitting and wafer Surface Grinding processes




Systematic troubleshooting of equipment‑related problems
Implement and refine qualification plans for new on‑line processes
Qualify new production tools with external suppliers and internal criteria
Collaborate with equipment engineers to understand interactions and operating limits
Train new operators, technicians and engineers
Support R&D; projects xysqume and contribute to yield and industrialization
Produce and present reports to management and technical committees
PhD or Master in engineering/physics/material science/chemistry
Experience in silicon processing is a plus
In this role you will contribute to the SiC technology ramp‑up at ST in a new mass‑production fab in Catania, driving efficient finishing pr...
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📌 SiC Process Engineering - Wafer Laser Splitting & Grinding M/F (Catania)
🏢 Altro
📍 Catania