Position Overview
As a Senior Advanced Packaging & Power Delivery Engineer at Axelera AI, you will play a pivotal role in shaping the silicon and packaging architecture of next‐generation AI accelerators. You will own power‐delivery design across the full stack – from on‐die power grids to package and PCB PDN – and bring deep expertise in advanced packaging technologies to help us scale from today's products to tomorrow's multi‐chiplet, 3D‐integrated systems.
Working within our R&D; Custom Design team and collaborating closely with Silicon Engineering and AI Integrated Systems, you will be at the intersection of analog design, packaging innovation, and product delivery – with real ownership and direct impact on the chips we ship.
Key Responsibilities
Own power‐delivery design end to end, from on‐die power grids to package and PCB PDN design and analysis.
Lead advanced packaging architecture decisions for 2.5D/3D stacking, multi‐chiplet integration, and interposer/substrate co‐design.
Perform SI/PI verification and sign‐off across the full stack,
ensuring power integrity and signal integrity targets are met.
Collaborate with the AIIS and Silicon Engineering teams to align power delivery and packaging solutions with product and silicon requirements.
Support thermal and integration reviews for current and future products.
Develop and maintain power‐delivery methodology, flows, and design guidelines within the Custom Design toolchain.
Identify and mitigate single‐point‐of‐failure risks in SI/PI workstreams; mentor and grow the team's packaging expertise.
Engage with external partners, substrate/interposer vendors, and OSAT houses to co‐develop advanced packaging solutions.
Qualifications
Required
Bachelor's or Master's degree in Electrical Engineering, Microelectronics, or a related field; PhD is a plus.
7+ years of experience in power delivery and/or advanced packaging design in a semiconductor or deep‐tech environment.
Demonstrated expertise in on‐die power grid design
📌 Advanced Packaging (Italia)
🏢 Altro
📍 Italia