Photonic Packaging Engineer • Toscana, Italy
My client is searching for a Photonics Packaging Engineer to join their R&D; team, based onsite in Pisa, Italy. This is an excellent opportunity for an engineer experienced in photonic and optoelectronic device packaging to contribute to the development of next‐generation photonic technologies.
Responsibilities
Design and develop advanced photonic and optoelectronic devices, focusing on performance, manufacturability, and reliability.
Support micro‐optical and fiber‐optic assembly.
Engage in assembly processes such as die‐attach, flip‐chip, and wire bonding.
Collaborate with engineers on integrated packaging solutions.
Support prototyping, testing, and process optimisation.




Qualifications
Knowledge of photonic and semiconductor packaging.
Hands‐on experience with micro‐optical or fiber‐optic assembly processes, e.g., optical coupling.
Knowledge of semiconductor assembly flows, e.g., wire bonding.
Proficiency with CAD.
Master's degree in Physics, Electronics, or a related field.
If you are looking to join a collaborative R&D; environment developing cutting‐edge photonic technologies, get in touch with Ella Flynn at IC Resources.
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📌 Photonics Packaging Engineer (Italia)
🏢 Altro
📍 Italia