My client is searching for a Photonics Packaging Engineer, to join their R&D; team, based onsite in Pisa, Italy.
This is an excellent opportunity for an Engineer experienced in photonic and optoelectronic device packaging, to contribute to the development of next-generation photonic technologies.
Your responsibilities:
- Design and develop advanced photonic and optoelectronic devices, focusing on performance, manufacturability, and reliability
- Support micro-optical and fiber optic assembly
- Engage in assembly processes eg. die-attach, flip-chip and wire bonding
- Collaborate with engineers on integrated packaging solutions
- Support prototyping, testing, and process optimisation

You will have:
- Knowledge of photonic and semiconductor packaging
- Hands-on experience with micro-optical or fibre optic assembly processes, eg. optical coupling
- Knowledge of semiconductor assembly flows eg. wire bonding
- Proficiency with CAD
- Masters degree in Physics, Electronics, or a related field

If you are looking to join a collaborative R&D; environment developing cutting-edge photonic technologies, get in touch with Ella Flynn at IC Resources

📌 Photonics Packaging Engineer (Italia)
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