My client is searching for a Photonics Packaging Engineer, to join their R&D; team, based onsite in Pisa, Italy.

Se è interessato/a a candidarsi per questo lavoro, la preghiamo di assicurarsi di soddisfare i seguenti requisiti, elencati di seguito.

This is an excellent opportunity for an Engineer experienced in photonic and optoelectronic device packaging, to contribute to the development of next-generation photonic technologies.

Your responsibilities:

- Design and develop advanced photonic and optoelectronic devices, focusing on performance, manufacturability, and reliability
- Support micro-optical and fiber optic assembly
- Engage in assembly processes eg. die-attach, flip-chip and wire bonding
- Collaborate with engineers on integrated packaging solutions




- Support prototyping, testing, and process optimisation

You will have:

- Knowledge of photonic and semiconductor packaging
- Hands-on experience with micro-optical or fibre optic assembly processes, eg. optical coupling
- Knowledge xlwpduy of semiconductor assembly flows eg. wire bonding
- Proficiency with CAD
- Masters degree in Physics, Electronics, or a related field

If you are looking to join a collaborative R&D; environment developing cutting-edge photonic technologies, get in touch with Ella Flynn at IC Resources

📌 Photonics Packaging Engineer (Ficarazzelli-bagni Italia)
🏢 Ic Resources
📍 Ficarazzelli-bagni Italia