My client is searching for a Photonics Packaging Engineer, to join their R&D team, based onsite in Pisa, Italy.This is an excellent opportunity for an Engineer experienced in photonic and optoelectronic device packaging, to contribute to the development of next-generation photonic technologies.Your responsibilities:Design and develop advanced photonic and optoelectronic devices, focusing on performance, manufacturability, and reliabilitySupport micro-optical and fiber optic assemblyEngage in assembly processes eg. die-attach, flip-chip and wire bondingCollaborate with engineers on integrated packaging solutionsSupport prototyping, testing, and process optimisationYou will have:Knowledge of photonic and semiconductor packagingHands-on experience with micro-optical or fibre optic assembly processes, eg. optical couplingKnowledge of semiconductor assembly flows eg. wire bondingProficiency with CADMasters degree in Physics, Electronics, or a related fieldIf you are looking to join a collaborative R&D environment developing cutting-edge photonic technologies, get in touch with Ella Flynn at IC Resources

📌 Photonics Packaging Engineer (Italia)
🏢 Ic Resources
📍 Italia