pMy client is searching for a Photonics Packaging Engineer, to join their RD team, based onsite in Pisa, Italy. /ppbr/ppThis is an excellent opportunity for an Engineer experienced in photonic and optoelectronic device packaging, to contribute to the development of next-generation photonic technologies. /ppbr/ppYour responsibilities: /pulliDesign and develop advanced photonic and optoelectronic devices, focusing on performance, manufacturability, and reliability /liliSupport micro-optical and fiber optic assembly /liliEngage in assembly processes eg. die-attach, flip-chip and wire bonding /liliCollaborate with engineers on integrated packaging solutions /liliSupport prototyping, testing, and process optimisation /li /ulpbr/ppYou will have: /pulliKnowledge of photonic and semiconductor packaging /liliHands-on experience with micro-optical or fibre optic assembly processes, eg. optical coupling /liliKnowledge of semiconductor assembly flows eg. wire bonding /liliProficiency with CAD /liliMasters degree in Physics, Electronics, or a related field /li /ulpbr/ppIf you are looking to join a collaborative RD environment developing cutting-edge photonic technologies, get in touch with Ella Flynn at IC Resources /p

📌 Photonics Packaging Engineer (Toscana)
🏢 Ic Resources
📍 Toscana