ph3OUR STORY /h3pAt ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society.
We are a global semiconductor company, and our advanced technology chips forms the hidden part of the world we live in today.
/ph3OUR STORY /h3pWhen you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators makers of technology around the world!
/ppDeveloping technologies takes more than talent: it takes amazing people who understands collaboration and respect.
People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
/ppWorking at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way.
Our technology starts with you.
Join us and start the future!
/ppYou will be a key contributor to SiC Technology volume ramp-up in ST. The work location will be in the new mass-production fab in Catania: this facility will be a first of a kind in Europe for the production in volume of SiC substrates, integrating all steps in the production flow up to final device realization.
/ppStrong link is maintained with STMicroelectronics Silicon Carbide AB, located in Norrköping, Sweden, with opportunities for on-site training and collaboration.
STMicroelectronics Silicon Carbide AB, previously named Norstel AB, is the ST competence center in SiC material technology: the company has been developing silicon carbide for 20 years, first at Linköping University, and since **** in a dedicated production facility in Norrköping.




/ppYour role will be part of the Laser Splitting and Grinding Process Engineering team within the Finishing Module.
/ppThe focus of the group will be to maintain high product quality, defining process flows and recipes, ensuring equipment performances, understanding and exploiting the interactions between different process steps and to drive the ramp-up phase to the mass-production environment.
/ph3Key Responsibilities /h3ulliHands-on work with processes and tools used in SiC semiconductor technology, especially in the Laser Splitting and in the wafer Surface Grinding area.
/liliConduct systematic troubleshooting of equipment-related problems /liliImplement and refine procedures and qualification plans for bringing new processes on line /liliQualify new production tools with external suppliers and against internal criteria /liliWork closely with equipment engineers to understand equipment interactions and limitations relative to operating specifications.
/liliTrain new employees (operators, technicians and engineers) /liliEnsure process robustness and stability by managing equipment control charts, tool alarms, fault detection /liliSupport RD projects /liliContribute to yield enhancement and process industrialization /liliProduce and present reports to a multi-skilled managerial and/or technical committee /li /ulh3Your Skills Experiences /h3ulliPhD or Master in scientific faculty, e.g. in Engineering (especially Mechanical), Physics, Material Science,



Chemistry /liliExperience in silicon processing and flow knowledge is a plus /liliPrecision, attention to details and good manual skills /liliFluent English is a must /liliSkills in Data Analysis are a plus /liliGood communication skills and able to work in a team /liliCommitted, Proactive and Curious /li /ulpThe expected salary range for this position is €38,000 – €45,000 gross annual salary (RAL), plus variable pay relevant for the role.
/ppIn accordance with the EU Pay Transparency Directive and applicable Italian legislation, this compensation range has been determined based on objective, gender-neutral criteria, including job responsibilities, required skills, relevant experience, qualifications, and market benchmarks.
Placement within the range will depend on the candidate's profile and demonstrated competencies.
The final offer will be made in compliance with the applicable National Collective Bargaining Agreement (CCNL), where relevant, and our internal compensation policies.
We are committed to equal pay for equal work and equal opportunities for all candidates.
/ppDiversity, Equity and Inclusion (DEI) is part of our company culture.
Our DEI vision is, "At ST, you can be the true version of yourself", we value all employee contributions and have zero tolerance for any kind of discrimination.
/ppJoining us is also about a greater work-life balance and workplace with equal opportunities.
Dedicated Employee Resource Groups for women and LGBTQIA+, hybrid work arrangements are amongst the many DEI Sustainability initiatives that make us a great place to evolve your career.
/ppTo discover more, visit st.com/careers /p /p #J-*****-Ljbffr

📌 Sic Process Engineering - Wafer Laser Splitting & Grinding M/F (Catania)
🏢 STMicroelectronics Italia
📍 Catania