My client is searching for a Photonics Packaging Engineer, to join their R&D; team, based onsite in Pisa, Italy.
This is an excellent opportunity for an Engineer experienced in photonic and optoelectronic device packaging, to contribute to the development of next-generation photonic technologies.
Your responsibilities: Design and develop advanced photonic and optoelectronic devices, focusing on performance, manufacturability, and reliability Support micro-optical and fiber optic assembly Engage in assembly processes eg.
die-attach, flip-chip and wire bonding Collaborate with engineers on integrated packaging solutions Support prototyping, testing, and process optimisation You will have: Knowledge of photonic and semiconductor packaging Hands-on experience with micro-optical or fibre optic assembly processes, eg.
optical coupling Knowledge of semiconductor assembly flows eg.
wire bonding Proficiency with CAD Masters degree in Physics, Electronics, or a related field If you are looking to join a collaborative R&D; environment developing cutting-edge photonic technologies, get in touch with Ella Flynn at IC Resources

📌 Photonics Packaging Engineer (Pisa)
🏢 Ic Resources
📍 Pisa