My client is searching for a Photonics Packaging Engineer, to join their R&D; team, based onsite in Pisa, Italy. This is an excellent opportunity for an Engineer experienced in photonic and optoelectronic device packaging, to contribute to the development of next-generation photonic technologies.
Se i requisiti e l'esperienza richiesti per questo lavoro corrispondono alle sue competenze, la preghiamo di candidarsi tempestivamente.
Your responsibilities:
Design and develop advanced photonic and optoelectronic devices, focusing on performance, manufacturability, and reliability
Support micro-optical and fiber optic assembly
Engage in assembly processes eg. die-attach, flip‑chip and wire bonding
Collaborate with engineers on integrated packaging solutions




Support prototyping, testing, and process optimisation
You will have:
Knowledge of photonic and semiconductor packaging
Hands‑on experience with micro-optical or fibre optic assembly processes, eg. optical coupling
Knowledge of semiconductor xysqume assembly flows eg. wire bonding
Proficiency with CAD
Masters degree in Physics, Electronics, or a related field
If you are looking to join a collaborative R&D; environment developing cutting‑edge photonic technologies, get in touch with Ella Flynn @ IC Resources.
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📌 Photonics Packaging Engineer (Firenze)
🏢 Altro
📍 Firenze