Process Integrator

Advanced Packaging & Glass Substrates About Ephos

Ephos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers.

We have already delivered products to leading global firms, and we are currently building a new fabrication facility to scale production by 100x. This expansion is backed by a $50M EU CHIPS Act grant—the first ever awarded to a startup. The role

We are seeking a Process Integrator to drive the development of next-generation microelectronics modules. In this role, you will be the architect of our process flows, connecting individual unit steps (such as lithography, etching, metallization, and bonding) into a cohesive, high-yielding manufacturing line.

You will design project-oriented integration flows by maximizing our internal R&D; equipment baseline and establishing strategic external partnerships. Once a robust process flow is established, you will champion the technology transfer to our mass manufacturing teams. Your responsibilities

Design, develop, and execute end-to-end integration flows for advanced packaging schemes on glass substrates.

Assess internal R&D; tool capabilities to build prototype flows. Where gaps exist, identify, negotiate, and manage technical relationships with external foundries, OSATs, or research institutes to complete the flow.

Stay at the forefront of state-of-the-art advanced packaging techniques (e.g., 2.5D/3D integration, wafer-level packaging, chiplet integration) and evaluate how to implement them into current projects.

Analyze physical, chemical, and mechanical interactions between sequential process steps (e.g., thermal mismatch, warpage, adhesion layer integrity)



to resolve complex integration bottlenecks.

Lead the documentation, risk assessment (FMEA), and knowledge transfer of mature R&D; process flows to high-volume manufacturing (HVM) facilities, ensuring a seamless transition. The candidate we are looking for

Master’s or Ph.D. in Materials Science, Electrical Engineering, Physics, Chemical Engineering, Microelectronics, or a related discipline.

5+ years of experience in semiconductor integration, advanced packaging development, or specialized glass substrate manufacturing.

Thorough understanding of state-of-the-art advanced packaging techniques (e.g., bump/hybrid bonding, redistribution layers (RDL), fine-pitch line/space patterning, or silicon/glass interposers).

Proven experience defining and executing multi-step fabrication flows from concept to functional device.

Demonstrated ability to work with external vendors, consortiums, or foundry partners to run external lots or co-develop process steps.

Can commit to tempo pieno lab presence; due to the nature of the role we will not consider remote applicants.

Excellent documentation habits and the communication skills necessary to translate complex R&D; insights into clear instructions for mass production teams.

Ephos is a demanding environment. We operate with exceptional ambition and move fast, because the market gives us no other option. We expect excellence from you, as we do from one another. This environment offers unmatched opportunities to learn, build, and grow, but it also requires significant commitment. What we offer

Top of the market salary.

Stock options; granted at this stage, they can become extremely valuable.

An exceptional opportunity for growth. The hiring process

Interview with our Head of Process.

Interview with a senior Process Engineer of our team, with a practical exercise.

Interview with our CEO. If you're interested in this opportunity, please send your CV to [email protected], with the role name in the subject line.

📌 Process Integrator (Milano)
🏢 Ephos
📍 Milano