Staff MEMS Packaging Engineer: Lead Simulations & NPI (Assago)

Staff MEMS Packaging Engineer: Lead Simulations & NPI (Assago)

04 ago
|
TDK InvenSense
|
Assago

04 ago

TDK InvenSense

Assago

A global semiconductor company in Assago is seeking an Advanced Packaging Engineer

Non aspetti a candidarsi dopo aver letto questa descrizione: per questa occasione è previsto un elevato volume di candidature.
- Staff.

You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams.

Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging.

Strong communication and knowledge of semiconductor materials are essential. xysqume

This full-time role supports innovation in a dynamic environment.
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📌 Staff MEMS Packaging Engineer: Lead Simulations & NPI (Assago)
🏢 TDK InvenSense
📍 Assago

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