ph3Position Overview /h3 pAs a Senior Advanced Packaging Power Delivery Engineer at Axelera AI, you will play a pivotal role in shaping the silicon and packaging architecture of next‑generation AI accelerators. You will own power‑delivery design across the full stack – from on‑die power grids to package and PCB PDN – and bring deep expertise in advanced packaging technologies to help us scale from today’s products to tomorrow’s multi‑chiplet, 3D‑integrated systems. /p pWorking within our RD Custom Design team and collaborating closely with Silicon Engineering and AI Integrated Systems, you will be at the intersection of analog design, packaging innovation, and product delivery – with real ownership and direct impact on the chips we ship. /p h3Key Responsibilities /h3 ul liOwn power‑delivery design end to end, from on‑die power grids to package and PCB PDN design and analysis. /li liLead advanced packaging architecture decisions for 2.5D/3D stacking, multi‑chiplet integration, and interposer/substrate co‑design. /li liPerform SI/PI verification and sign‑off across the full stack, ensuring power integrity and signal integrity targets are met. /li liCollaborate with the AIIS and Silicon Engineering teams to align power delivery and packaging solutions with product and silicon requirements. /li liSupport thermal and integration reviews for current and future products. /li liDevelop and maintain power‑delivery methodology, flows, and design guidelines within the Custom Design toolchain. /li liIdentify and mitigate single‑point‑of‑failure risks in SI/PI workstreams; mentor and grow the team's packaging expertise.



/li liEngage with external partners, substrate/interposer vendors, and OSAT houses to co‑develop advanced packaging solutions. /li /ul h3Qualifications /h3 pbRequired /b /p ul liBachelor’s or Master’s degree in Electrical Engineering, Microelectronics, or a related field; PhD is a plus. /li li7+ years of experience in power delivery and/or advanced packaging design in a semiconductor or deep‑tech environment. /li liDemonstrated expertise in on‑die power grid design and package/PCB PDN analysis. /li liHands‑on experience with 2.5D and/or 3D IC packaging technologies, multi‑chiplet integration, and interposer/substrate co‑design. /li liProficiency with industry‑standard EDA tools for power integrity, PDN simulation, and package design. /li liAbility to work cross‑functionally and communicate complex technical trade‑offs to diverse stakeholder groups. /li liStrong written and spoken English communication skills. /li /ul pbNice to Have /b /p ul liExperience with SI/PI verification and sign‑off methodologies. /li liFamiliarity with thermal modeling and co‑simulation for integrated packages. /li liExposure to AI accelerator or custom ASIC design flows. /li liExperience collaborating with OSAT partners, substrate vendors,



or research institutes (e.g., imec). /li liKnowledge of advanced node custom and analog design practices. /li /ul h3Location /h3 pWe offer a flexible working arrangement, with options to: /p ul liWork from one of our Axelera AI offices (Leuven in Belgium, Amsterdam and Eindhoven in the Netherlands, Zurich in Switzerland, Florence and Milan in Italy or Bristol in the United Kingdom) if you are already based in the vicinity. /li liWork fully remotely from any European country (incl. the UK) you are already in. /li liRelocate with us and work from Italy (Florence or Milan) or the Netherlands (Amsterdam or Eindhoven). /li /ul pKindly note that priority will be given to candidates who are interested in being based in Belgium or Italy. /p h3What We Offer /h3 pThis is your chance to shape and be part of a dynamic, fast‑growing, international organization. We offer an attractive compensation package, including a pension plan, extensive employee insurances and the option to get company shares. /p pAn open culture that supports creativity and continual innovation is awaiting you. Collaborative ownership and freedom with responsibility is characteristic for the way we act and work as a team. /p h3Equal Opportunity /h3 pAt Axelera AI, we wholeheartedly embrace equal opportunity and hold diversity in the highest regard. Our steadfast commitment is to cultivate a warm and inclusive environment that empowers and celebrates every member of our team. We welcome applicants from all backgrounds to join us in shaping the future of AI. /p /p #J-18808-Ljbffr

📌 Advanced Packaging & Power Delivery Senior Engineer (Italia)
🏢 Axelera AI
📍 Italia