07 ago
|
Elettrotecnica
|
Italia
07 ago
Elettrotecnica
Italia
Nexperia is seeking a Principal Engineer for GaN Package Development in Catania, Italy. This role focuses on developing and industrializing advanced packaging technologies for GaN power devices. The ideal candidate will lead package architecture, ensuring performance, reliability, and cost targets.
The position involves close collaboration across R&D;, design, and manufacturing, driving continuous improvement and quality. An academic background in relevant engineering fields and significant experience in semiconductor R&D; are essential.
Join our dynamic team at Nexperia and work on innovative solutions within a diverse and inclusive environment.
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📌 Principal GaN Packaging Engineer: Innovation (Italia)
🏢 Elettrotecnica
📍 Italia