ppEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. /ppWe have already delivered products to leading global firms, and we are currently building a new fabrication facility to scale production by 100x. This expansion is backed by a $50M EU CHIPS Act grant—the first ever awarded to a startup. /ppbThe role /b /ppWe are seeking a Process Integrator to drive the development of next-generation microelectronics modules. In this role, you will be the architect of our process flows, connecting individual unit steps (such as lithography, etching, metallization, and bonding) into a cohesive, high-yielding manufacturing line. /ppYou will design project-oriented integration flows by maximizing our internal RD equipment baseline and establishing strategic external partnerships. Once a robust process flow is established, you will champion the technology transfer to our mass manufacturing teams. /ppbYour responsibilities /b /pulliDesign, develop, and execute end-to-end integration flows for advanced packaging schemes on glass substrates. /liliAssess internal RD tool capabilities to build prototype flows. Where gaps exist, identify, negotiate, and manage technical relationships with external foundries, OSATs, or research institutes to complete the flow. /liliStay at the forefront of state-of-the-art advanced packaging techniques (e.g., 2.5D/3D integration, wafer-level packaging, chiplet integration) and evaluate how to implement them into current projects. /liliAnalyze physical, chemical, and mechanical interactions between sequential process steps (e.g., thermal mismatch, warpage, adhesion layer integrity)



to resolve complex integration bottlenecks. /liliLead the documentation, risk assessment (FMEA), and knowledge transfer of mature RD process flows to high-volume manufacturing (HVM) facilities, ensuring a seamless transition. /li /ulpbThe candidate we are looking for /b /pulliMaster’s or Ph.D. in Materials Science, Electrical Engineering, Physics, Chemical Engineering, Microelectronics, or a related discipline. /lili5+ years of experience in semiconductor integration, advanced packaging development, or specialized glass substrate manufacturing. /liliThorough understanding of state-of-the-art advanced packaging techniques (e.g., bump/hybrid bonding, redistribution layers (RDL), fine-pitch line/space patterning, or silicon/glass interposers). /liliProven experience defining and executing multi-step fabrication flows from concept to functional device. /liliDemonstrated ability to work with external vendors, consortiums, or foundry partners to run external lots or co-develop process steps. /liliCan commit to tempo pieno lab presence; due to the nature of the role we will not consider remote applicants. /liliExcellent documentation habits and the communication skills necessary to translate complex RD insights into clear instructions for mass production teams. /liliEphos is a demanding environment. We operate with exceptional ambition and move fast, because the market gives us no other option. We expect excellence from you, as we do from one another. This environment offers unmatched opportunities to learn, build, and grow, but it also requires significant commitment. /li /ulpbWhat we offer /b /pulliTop of the market salary. /liliStock options; granted at this stage, they can become extremely valuable. /liliAn exceptional opportunity for growth. /li /ulpbThe hiring process /b /pulliInterview with our Head of Process. /liliInterview with a senior Process Engineer of our team, with a practical exercise. /liliInterview with our CEO. /li /ul /p #J-18808-Ljbffr

📌 Process Integrator (Milano)
🏢 Ephos
📍 Milano