Process Integrator
Advanced Packaging & Glass Substrates
About Ephos
Ephos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers.
We have already delivered products to leading global firms, and we are currently building a new fabrication facility to scale production by 100x. This expansion is backed by a $50M EU CHIPS Act grant—the first ever awarded to a startup.
The role
We are seeking a Process Integrator to drive the development of next-generation microelectronics modules. In this role, you will be the architect of our process flows, connecting individual unit steps (such as lithography, etching, metallization, and bonding) into a cohesive, high-yielding manufacturing line.
You will design project-oriented integration flows by maximizing our internal R&D; equipment baseline and establishing strategic external partnerships. Once a robust process flow is established, you will champion the technology transfer to our mass manufacturing teams.
Your responsibilities
Design, develop, and execute end-to-end integration flows for advanced packaging schemes on glass substrates.
Assess internal R&D; tool capabilities to build prototype flows. Where gaps exist, identify, negotiate, and manage technical relationships with external foundries, OSATs, or research institutes to complete the flow.
Stay at the forefront of state-of-the-art advanced packaging techniques (e.g., 2.5D/3D integration, wafer-level packaging, chiplet integration) and evaluate how to implement them into current projects.
Analyze physical, chemical, and mechanical interactions between sequential process steps (e.g., thermal mismatch, warpage, adhesion layer integrity) to resolve complex integration bottlenecks.
Lead the
📌 Process Integrator (Milano)
🏢 Ephos
📍 Milano