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Founded in ****, InvenSense Inc., a TDK Group Company, is the world's leading provider of MEMS sensor platforms.
InvenSense's vision of Sensing Everything targets the consumer electronics and industrial markets with integrated Motion and Sound solutions.
Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy.
InvenSense's motion tracking, audio and location platforms, and services can be found in many of the world's largest and most iconic brands including smartphones, tablets, wearables, drones, gaming devices, internet of things, automotive products, and remote controls for smart TVs.
InvenSense is headquartered in San Jose, CA, and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia, and Italy.
We're looking for top-notch innovators to join our global team.
If you're interested in being a part of our journey and helping us grow to become the leading provider of SoC platform solutions, we want to hear from you.
About the Role




Work in the TDK InvenSense Core Technology Packaging team providing leadership in the areas of package simulation and module level analysis supporting NPI assembly and technology development for all our motion products.
The scope of work includes 3D model generation, material characterization, mechanical simulations (static, dynamic, linear, non-linear analyses), thermal and thermomechanical simulations, electromagnetic and coupled Multiphysics simulations.
You will be expected to work closely with MEMS design, assembly and validation teams to explore new materials and new assembly methods for MEMS motion sensors.
The job will involve close interaction with cross-functional teams across the company, overseas manufacturing houses (OSATs), and as well as close interactions with internal & external customers.
Job Qualifications
MS or Ph.D. in Mechanical Engineering, Electrical or MEMS Engineering, Physics, or similar discipline
5+ years of experience with simulation in the field of MEMS, ideally MEMS packaging (e.g. accelerometer, gyroscope, microphone, and magnetometer)
Strong expertise in FEM/cross domain/multiphysics simulations (e.g. die/package/socket interactions, thermo-mechanical and electromagnetic simulations)
Strong skills in using modeling and simulation, programming and 2D/3D CAD software tools (Ex: Ansys, Comsol, APDL, Matlab, Python, AutoCAD, SolidWorks,



Inventor)
Ability to analyze/validate, interpret and effectively communicate simulation results to stakeholders both verbally and in presentations
Broad knowledge of semiconductor/MEMS materials (including characterization), microelectronics and assembly processes
Prefer experience working with suppliers/OSATs, NPI, in high volume manufacturing environment
Prefer working knowledge of statistical process control and statistical tolerance analyses
Ability to work in an internationally distributed, fast-paced, product focused environment
Possible locations: Milan (Assago), Munich.
xysqume
Seniority levelSeniority levelAssociate
Employment typeEmployment typeFull-time
Job functionJob functionResearch and Engineering
IndustriesSemiconductor Manufacturing
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📌 Advanced Packaging Engineer - Staff (Bardi)
🏢 TDK InvenSense
📍 Bardi