ppCentral Hardware Engineering Institute (CHEI) at Huawei Milan Research Center focuses on advanced hardware technologies for next-generation ICT systems, with strong emphasis on high-speed interconnects, signal integrity (SI), and system-level performance optimization.
The team develops both engineering solutions and internal methodologies/tools to enable robust, scalable hardware design.
/p pJoin the team and take ownership of signal integrity, from individual high-speed interconnects to system-level channel performance.
You'll deliver rigorous SI analysis on real products and build the reusable methods, workflows, and tooling that make the whole team faster and more scalable.
/p h3Role Overview /h3 pYou will own signal integrity across the full design stack, from PCB and package to system-level interconnects, while building the reusable workflows and tooling that raise the team's efficiency on every project that follows.
/p h3Responsibilities /h3 ul liOwn end-to-end signal integrity analysis for high-speed channels, from early-stage design to final validation.
/li liDrive optimization of PCB, package, and interconnect performance under real-world operating conditions.
/li liDevelop and maintain engineering tools, scripts, and workflow automation that improve team efficiency and reproducibility.
/li liBuild reusable electromagnetic modeling methodologies tailored to high-speed applications, creating lasting intellectual assets for the team.
/li liTranslate SI analysis results into actionable design guidelines that directly support hardware development decisions.
/li liShape the team's technical roadmap on high-speed interconnect directions, bringing in technical insights from both industry practice and academic research.
/li /ul h3What We're Looking For /h3 ul liA solid theoretical foundation in Electrical Engineering, Physics, or a related STEM field,



demonstrated through an advanced degree and/or 5+ years of hands?on industrial experience.
/li liFamiliarity with SI fundamentals: interconnect modeling, EM theory, and channel-level metrics such as eye diagrams, crosstalk, BER indicators, and TDR.
/li liHands?on experience with EM, SI, or multiphysics simulation tools (e.g. HFSS, ADS, CST, COMSOL, SIwave), with the ability to critically assess simulation quality and the physical intuition to validate results and spot numerical artifacts.
/li liA software engineering mindset: experience building engineering tools or automation pipelines in Python or similar languages, going beyond one?off scripting.
/li liClear and effective communication in English, including technical reporting and cross?functional collaboration.
/li /ul pWe recognize that SI is a broad discipline, and that talented engineers from adjacent fields (EM modeling, RF, packaging, photonics, or numerical methods) can and do excel in this role.
If you have strong fundamentals and a genuine drive to master the domain, we want to hear from you.
/p h3Nice to Have /h3 ul liPrior experience delivering SI results on real high-speed hardware systems, including TDR-based validation, differential signal analysis, and skew characterization.
/li liFamiliarity with high-speed interface standards (PCIe, Ethernet, DDR, SerDes) and passive components.
/li liExperience with statistical SI analysis: Monte Carlo, worst?case corner analysis, or DoE.
/li liBackground in advanced packaging, or chip?package co?design.
/li liExperience with model order reduction, surrogate modeling,



or machine learning applied to SI/EM problems.
/li /ul h3What We Offer /h3 pWe offer you an exciting professional career in one of the leading and fastest growing multinational telecommunication companies, challenging work and a competitive salary package.
Personal development is ensured through many training opportunities in Western Europe and abroad.
/p pWe offer a gross annual salary typically ranging from €60,000 to €75,000 determined according to objective criteria such as professional experience, competencies, and seniority.
Employees may also be considered for a discretionary annual premio ranging from 0 to 2 monthly salaries, subject to company evaluation.
The applicable collective bargaining agreement is the CCNL Telecommunications, within levels 6° and 7°.
/p h3Privacy Statement /h3 pWe therefore commit to protecting your privacy following the local legal data privacy legislation.
Please read and understand our West European Recruitment Privacy Notice before submitting your personal data to Huawei so that you fully understand how we process and manage your personal data received.
If you have any queries in regards to Huawei WEU Data Privacy please feel free to contact our WEU Data Protection Officer by clicking.
/p h3Equal Opportunity Employer /h3 pHuawei is an Equal Opportunity Employer and do not discriminate based on race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, genetic information, or any other legally protected status.
All qualified applicants will receive consideration for employment without regard to these characteristics.
We are committed to creating an inclusive and diverse workplace.
/p h3Company Info /h3 pHuawei Technologies Italia S.r.l. /p pRegistered Office: Via Lorenteggio 240, Tower A, Milan /p pRD Office address: Viale Martesana 12, ***** Vimodrone (MI) /p /p #J-*****-Ljbffr

📌 High-Speed Signal Integrity Engineer (Bardi)
🏢 HUAWEI TECHNOLOGIES ITALIA
📍 Bardi