Hardware Layout Engineer (Italia)

Hardware Layout Engineer (Italia)

13 ago
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Altro
|
Italia

13 ago

Altro

Italia

Hardware Layout Engineer • Roma, Lazio, IT Per il seguente ruolo potrebbero essere richieste diverse soft skill ed esperienze. La preghiamo di consultare attentamente la panoramica riportata di seguito. We are looking for technology game changers to lead Stellantis into a fundamental transformation within the automotive industry. Technology is going to disrupt the automotive industry significantly in the next decade, and our organization is seeking high‐potential candidates to transform the company with a focus on the customer experience. Key Responsibilities Work with electrical engineers to design circuit board assemblies, including MCU, SOC, high voltage, high power, HDI, and high‐speed circuits. Design printed circuit boards that meet high‐volume production grade. Lead layout reviews with internal and external teams. Monitor layout progress and manage change. Collaborate with mechanical engineers on mechanical‐electrical packaging. Support quick‐turn board builds with PCB contract manufacturers. Release technical documents such as BOM, design procedures,



and design for manufacture. Distribute layout drawings to various teams and coordinate their layout activities to ensure compliance with layout rules. Basic Qualifications Bachelor of Science degree in Electrical Engineering or equivalent from an ABET‐accredited university. At least four years of experience in the layout of high‐speed PCBs. Experience routing high‐speed digital DDRx (4 gen minimum) memory interface, PCIe, etc. Experience with constraints‐driven PCB layout methodology. Experience in building and maintaining design guidelines. Experience in PCB layer stack‐up design. Library and layout review process expertise. IPC standards for symbol and footprint creation. Gerber release process knowledge. Preferred Qualifications Experience in industrial or automotive (TIER1) area. Detailed understanding of high‐speed digital PCB routing constraints and multilayer PCB construction. Experience with BGA pitch eq

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