We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

- Technical expert responsible for physical implementation of high-speed digital and mixed-signal blocks for communication ICs
- Own place-and-route implementation activities
- Define physical design methodologies
- Optimize PPA,



timing closure and signal integrity
- Coordinate implementation sign-off
- Support tape-out execution

- MSc in Electrical Engineering
- 10+ years physical design experience
- Place-and-route tools
- STA and physical verification
- Floorplanning, CTS, IR-drop and EM analysis
- Advanced CMOS node experience, including FinFET and/or FD-SOI, is required
- Physical implementation experience for high-speed digital or mixed-signal ICs is required; implementation awareness of high-speed interfaces such as UCIe, PCIe or similar protocols is an advantage

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📌 Principal HS Digital Place & Route Engineer (d/m/f) (Italia)
🏢 ams OSRAM
📍 Italia