We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.
Technical leader responsible for architecture and RTL development of high-speed digital subsystems for communication ICs and mixed-signal SoC products
Define digital subsystem architectures
Lead RTL development and integration




Drive design reviews and quality standards
Support verification and implementation teams
Mentor design engineers
MSc or PhD in Electrical Engineering
10+ years digital IC design experience
RTL design (Verilog/SystemVerilog)
High-speed digital IC design experience for communication or mixed-signal SoC products is required; knowledge of high-speed interfaces such as UCIe, PCIe or similar protocols is an advantage
Interface protocols and clock-domain crossing
Synthesis and timing analysis
Advanced CMOS node experience, including FinFET and/or FD-SOI, is required
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📌 Principal Hs Digital Design Engineer (D/M/F) (Italia)
🏢 ams OSRAM
📍 Italia