We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.
- Technical authority responsible for defining broadband optical communication IC architectures and technology Roadmaps
- Defines architectures for broadband optical communication ICs and provides technical leadership for strategic developments
- Develop system and IC architectures
- Translate requirements into subsystem specifications
- Lead architecture trade-off analysis




- Support implementation teams through development and validation
- Participate in customer and technology roadmap discussions
- Guide engineering teams on architectural decisions
- MSc or PhD in Electrical Engineering or related field
- 15+ years semiconductor IC development experience
- Multiple successful broadband optical communication IC tape-outs in advanced CMOS nodes
- Broadband optical communication IC and PHY architectures, including high-speed optical links, electro-optical interfaces and link-level trade-offs; awareness of layout-dependent effects is an advantage
- TIA, VCSEL drivers, SerDes, PLL/CDR and ADC/DAC architectures
- Advanced CMOS node experience, including FinFET and/or FD-SOI, is required
- MATLAB, Python and/or system modeling tools

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📌 Senior Principal Engineer (Italia)
🏢 ams OSRAM
📍 Italia