We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.
Technical authority responsible for defining broadband optical communication IC architectures and technology Roadmaps
Defines architectures for broadband optical communication ICs and provides technical leadership for strategic developments
Develop system and IC architectures
Translate requirements into subsystem specifications
Lead architecture trade-off analysis




Support implementation teams through development and validation
Participate in customer and technology roadmap discussions
Guide engineering teams on architectural decisions
MSc or PhD in Electrical Engineering or related field
15+ years semiconductor IC development experience
Multiple successful broadband optical communication IC tape-outs in advanced CMOS nodes
Broadband optical communication IC and PHY architectures, including high-speed optical links, electro-optical interfaces and link-level trade-offs; awareness of layout-dependent effects is an advantage
TIA, VCSEL drivers, SerDes, PLL/CDR and ADC/DAC architectures
Advanced CMOS node experience, including FinFET and/or FD-SOI, is required
MATLAB, Python and/or system modeling tools
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📌 Senior Principal Engineer - Broadband Ic Architect (D/M/F) (Italia)
🏢 ams OSRAM
📍 Italia