01 ott
|
Informatica / Software
|
Italia
01 ott
Informatica / Software
Italia
Bending Spoons invites outstanding students to join a multi-office internship program in Milan, London, Madrid, or Warsaw. From June to September 2027, you will work on real projects that reach customers and learn at a rate unmatched elsewhere.
Expect to investigate, innovate, test, execute, and iterate with world-class teams across product disciplines. We value reasoning, drive, teamwork, and English proficiency, and provide exceptional growth opportunities, with competitive pay and equity
📌 Summer Intern: AI-Driven Product Manager (Italia)
🏢 Informatica / Software
📍 Italia