Annapurna Labs, an Amazon AWS organization, is seeking a Sr.
Package Layout
Engineer to lead end-to-end physical design of advanced IC packages for AI silicon and data center ASICs. You will own layout from floor planning through tape-out, collaborating with silicon, SI/PI, thermal, and manufacturing teams to meet performance and reliability targets.
Responsibilities include driving 2.5D/3D packaging architectures, RDL/substrate routing, cross‑level optimization, and coordination with OSAT
📌 Senior Package Layout Engineer — 2.5D/3D-IC Packaging Lead (Asti)
🏢 Amazon
📍 Asti
Candidati a questo annuncio
Mostra le tue capacità professionali all'azienda, compila il form e lascia un tocco personale nella lettera di presentazione, aiuterà il recruiter nella scelta del candidato.