Annapurna Labs, an Amazon AWS organization, is seeking a Sr.
Package Layout Engineer to lead end-to-end physical design of advanced IC packages for AI silicon and data center ASICs.
You will own layout from floor planning through tape-out, collaborating with silicon, SI/PI, thermal, and manufacturing teams to meet performance and reliability targets.
Responsibilities include driving 2.5D/3D packaging architectures, RDL/substrate routing, cross?level optimization, and coordination with OSAT
#J-*****-Ljbffr
📌 Senior Package Layout Engineer — 2.5D/3D-Ic Packaging Lead (Asti)
🏢 Amazon
📍 Asti
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