Annapurna Labs in AWS seeks a Package Layout Design Engineer to contribute to the physical design of advanced IC packages for AI/ML and data center ASICs.È pronto/a a candidarsi? Si assicuri di aver compreso tutte le responsabilità e i compiti associati a questo ruolo prima di procedere.You will drive floorplanning, routing, and tape-out coordination with ASIC, SI/PI, and manufacturing teams. xysqume Lead aspects of 2.5D/3D-IC packaging, interposer design, and DFM compliance while advancing density, performance, and reliability targets in a fast-paced hardware environment.#J-18808-Ljbffr
📌 Ic Package Layout Engineer - 2.5d/3d-Ic Expert (Asti)
🏢 Amazon
📍 Asti