04 ott
|
Informatica / Software
|
Milano
04 ott
Informatica / Software
Milano
Bending Spoons invites outstanding students to join an internship program running from June to September **** in Milan, London, Madrid or Warsaw. You'll own real work that touches customers and learn at a rapid pace in a high-velocity environment.
Throughout the internship you'll investigate, innovate, test, execute and iterate with designers, engineers, and analysts to deliver tangible product improvements and learn from top talent across the company.
📌 Growth & Innovation Intern (Ai-Driven Product) (Milano)
🏢 Informatica / Software
📍 Milano