We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules.
You will drive package architecture, ensure performance, reliability, and cost targets, and lead cross-functional execution from concept through high-volume manufacturing.
Responsibilities
Lead development, optimization, and implementation of GaN packaging and assembly processes
Define package architectures aligned with performance, reliability, and cost targets
Collaborate cross-functional (R&D;, design, production, quality, purchasing) for seamless transfer to manufacturing
Specify, select, and qualify equipment, materials, and tooling
Develop and maintain process documentation, specifications, and engineering change records
Provide technical expertise to troubleshoot manufacturing issues and lead root cause analysis
Manage supplier qualification and support technology transfer for outsourced processes
Drive yield, quality, and continuous improvement using SPC and data-driven methodologies
Requirements
Bachelor's or Master's degree in Mechanical Engineering, Microelectronics, Materials Science, Physics, or related field
Strong experience in semiconductor backend R&D; and manufacturing, including assembly and packaging
Solid understanding of semiconductor backend processes and connection technologies
Knowledge of GaN packaging, device characteristics, and related manufacturing challenges (advantageous)
Familiarity with measurement systems, industry standards, and best practices
Strong analytical skills, including data interpretation, root cause analysis, and Six Sigma methodologies
Effective communication skills with a collaborative, cross-functional mindset
Results-driven, quality-focused, with the ability to manage multiple priorities independently




Department and Colleagues
Nexperia is a global leader in semiconductor components, powering essential electronics across automotive, industrial, mobile, and consumer markets.
Our Catania site is a key hub for advanced manufacturing and packaging innovation.
What Nexperia offers
Opportunity to work on cutting-edge technologies in a collaborative and innovative environment.
Strong connection with academic and industrial partners.
Career development in a global organization with a focus on sustainability and electrification.
D&I; Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better.
We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris **** Paralympic Games.
Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups.
Nexperia is committed to increasing women in management positions to 30% by ****.
Nexperia is a world-class company in semiconductor development and in-house production.
A proven global player with an entrepreneurial mentality.
At our core is an 12,000+ strong international network with a singular focus.
Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face.
We support, reward and challenge individuals equally, in a dynamic and energetic environment.
Looking to push boundaries in a company where your talents can shine?
Join TeamNexperia.
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📌 Principal Engineer Gan Package Development (Italia)
🏢 Nexperia
📍 Italia