My client is seeking a Photonics Packaging Engineer to support the development and integration of their PICs, for their global-leading, optical communications technology. You will help take devices from laboratory prototypes towards production-ready modules. This is an excellent opportunity for an engineer to develop their hands-on packaging experience within a growing photonics team. This is an onsite role, based in Milan.

Job responsibilities

- Support the packaging and integration of photonic integrated circuits, from prototype development through to product testing
- Assist with optical coupling, fibre alignment, attachment and bonding processes
- Help develop and improve assembly and packaging processes for manufacturability and scalability
- Carry out optical characterisation, testing and basic failure analysis of packaged devices
- Analyse experimental results and support improvements to package performance, reliability and yield
- Work closely with photonics, electronics and R&D; teams to integrate packaging requirements into product development

Experience required

- Degree in Photonics, Optical Engineering,



Electronic Engineering, Materials Science or a related discipline
- Some hands-on experience in photonics engineering, optoelectronics, semiconductor packaging or a related field
- Understanding of optical coupling, fibre alignment and attachment techniques
- Familiarity with photonic assembly processes and packaging technologies
- Basic knowledge of electrical interfaces, RF connectivity or optoelectronic integration
- Experience with laboratory testing, optical characterisation or experimental measurements
- Strong problem-solving skills and a willingness to develop practical engineering solutions
- Ability to work collaboratively within a multidisciplinary engineering team

Desirable

- Exposure to optical communications is preferred, but not essential
- Exposure to reliability testing, environmental qualification or failure analysis
- Experience working with external foundries, assembly houses or substrate suppliers

#J-18808-Ljbffr

📌 Photonics Packaging Engineer (Italia)
🏢 Intellectual Capital Resources
📍 Italia