21 ott
|
Intellectual Capital Resources
|
Bergamo
21 ott
Intellectual Capital Resources
Bergamo
My client is seeking a Photonics Packaging Engineer to support the development and integration of their PICs, for their global-leading, optical communications technology.
You will help take devices from laboratory prototypes towards production-ready modules.
This is an excellent opportunity for an engineer to develop their hands-on packaging experience within a growing photonics team.
This is an onsite role, based in Milan.
Job responsibilities- Support the packaging and integration of photonic integrated circuits, from prototype development through to product testing- Assist with optical coupling, fibre alignment, attachment and bonding processes- Help develop and improve assembly and packaging processes for manufacturability and scalability- Carry out optical characterisation, testing and basic failure analysis of packaged devices- Analyse experimental results and support improvements to package performance, reliability and yield- Work closely with photonics, electronics and R&D; teams to integrate packaging requirements into product development
Experience required- Degree in Photonics,
Optical Engineering, Electronic Engineering, Materials Science or a related discipline- Some hands-on experience in photonics engineering, optoelectronics, semiconductor packaging or a related field- Understanding of optical coupling, fibre alignment and attachment techniques- Familiarity with photonic assembly processes and packaging technologies- Basic knowledge of electrical interfaces, RF connectivity or optoelectronic integration- Experience with laboratory testing, optical characterisation or experimental measurements- Strong problem-solving skills and a willingness to develop practical engineering solutions- Ability to work collaboratively within a multidisciplinary engineering team
Desirable- Exposure to optical communications is preferred, but not essential- Exposure to reliability testing, environmental qualification or failure analysis- Experience working with external foundries, assembly houses or substrate suppliers#J-18808-Ljbffr
📌 Photonics Packaging Engineer (Bergamo)
🏢 Intellectual Capital Resources
📍 Bergamo