Thermo-Mechanical Chip-Package Engineer (Agrate Brianza)

Thermo-Mechanical Chip-Package Engineer (Agrate Brianza)

06 nov
|
STMicroelectronics Italia
|
Agrate Brianza

06 nov

STMicroelectronics Italia

Agrate Brianza

STMicroelectronics Italia is seeking an early-career to senior materials/physics/electronics specialist to design and qualify pad/pad over active structures for Smart Power processes. The role involves thermo-mechanical simulations and close collaboration with designers to ensure reliable structures.

You will coordinate CPI validation activities and work with EWS, assembly, and reliability tests across multiple platforms, aiming at robust, manufacturable solutions.

📌 Thermo-Mechanical Chip-Package Engineer (Agrate Brianza)
🏢 STMicroelectronics Italia
📍 Agrate Brianza

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Ricevi via email le nuove offerte di lavoro per: thermo-mechanical chip-package engineer (agrate brianza) / agrate brianza