Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Summary:As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below.
This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to:Main

Responsibilities:
Leading innovation in Dry Etch technology and essential module advancementDevelop and innovate dry etch processes to meet structural and electrical specifications.
Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products.
Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect outcomes.
Collaborate and lead cross-functional teams to solve complex structural problems.
Present process and technology roadmaps for current and future technology nodes.
Proactively predict when and how a future issue could arise and build mitigation plans.
Contribute towards the Technical Leadership Program.
Mentor less experienced engineers and encourage skills within the team.
Be associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase.
Other

Responsibilities:




Find opportunities and drive towards a collaborative solution.
Guide other areas on technology roadmaps.
Lead or be part of cross-functional task force groups driving towards a target.
Drive towards general expertise in other areas' process hardware or technologies.
Serve as a resource and mentor for colleagues in dry etch technology and/or project management.
Provide critical updates to upper management on project status and impacts.
AI

Responsibilities:
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirementsContributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
Minimum Required Qualifications/ExperiencePhD with 5 years, or Master’s degree with 7 years, in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering, or related fields along with at least 6 years of pertinent dry etch process development experience.
Minimum 5 years of applicable NAND, DRAM, or Logic module development experience, for example: projects and deliveries involving cross-functional teams.
Demonstrated interest in research and development environment.
Knowledge of plasma physics, plasma chemistry,



transport or surface phenomena gained through experience and/or coursework.
Demonstrated leadership in problem-solving. Experience in managing technical projects.
Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries).
Expertise in statistical process control and analysis.
Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes.
Lead supplier head-to-heads.
Must Have Technical SkillsStrong computer skills, including MS Office, and SAS software like JmP oe similar.
Data science basics/Python coding/AI coders shall be preferred over candidates without this experience.
Must Have Soft SkillsStrong statistical analysis, communication, and problem solving skills.
Experience in leading cross functional projects and mentoring junior engineers.
Strong analytical and problem solving skills.
Team player and self driver.
Embody Micron’s core values:People – Respect, develop, and empower othersInnovation – Drive continuous improvement and breakthrough thinkingTenacity – Show grit and determinationCollaboration – Build trust and foster teamworkCustomer Focus – Deliver excellence and valueSpeed – Act with purpose and set the paceThis announcement is intended to build a talent pipeline of professionals based in Europe who may be interested in future international career opportunities within Micron Technology Inc. and its affiliated group companies worldwide. Opportunities associated with this talent pipeline may require international mobility or relocation. The specific work location and the Micron entity acting as the prospective employer will be clearly communicated to candidates during the first intervie

📌 Dry Etch MTS/Principal Engineer, Process Development, Advanced NAND (Casarile)
🏢 MICRON
📍 Casarile